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Peksha

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  1. 1. The module is simply huge. 2. The mount doesn't look simple/precise/quick release and secure enough to install on your own. 3. No space for additional ECC chips for every 8 4. Due to the size, the length of the tracks from the farthest chip to the pad is increased compared to the closest
  2. SODIMM modules have exactly the size they are designed for - up to 2*8(9) chips. this is their physical limitation - chip have standard sizes. Inventing some new carrier for all the same chips with the same capacity, it is foolish to believe that the size of this module will be less than sodimm with the same number of those de chips. on one CAMM module, as in the pictures, you can exactly see the same amount - 2 * 8 * 2 with DSDR - this is a maximum of 64 GB for 16Gb chips. For 128GB, this should be either a double-sized module with the number of chips 2 * 2 * 8 * 2, or chips of a double capacity (which no one has yet seen live and it is not known whether they exist at the moment ), but then it is possible to assemble a couple of SODIMM modules
  3. It's desktop CPU specs for 128 GB. Only 3600MHz for 2DPC 2R dimms. And max 4400 MHz if you setup 1dimm (64GB using 1 channel via CAMM??)) This CAMM is a very strange option. the most logical thing is not to offer such a solution at all. It is likely that the next generation will receive a normal 128GB DDR5 support if the implementation for DDR4 is removed.
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