MyPC8MyBrain

not to mention most of this is not supported by current and likely next gen mobile CPU IMC's to begin with, these are "LaLa Land" numbers, by the time these will be a reality this platform will be too old to even get driver updates, pointless cramming into this particular platform generation imho.

i believe heat was the issue with the larger modules,

You don’t need to remove the interposer—dual 64 GB cSO-DIMMs can match or even outperform CAMM in sustained real-world performance while running cooler. The 4-channel CAMM design in laptops is more about marketing than transformative engineering. While it’s theoretically possible, current mobile CPU IMCs and chassis designs aren’t fully realizing that potential. HX-series CPUs support dual-channel memory configurations, so any “4-channel” claims are achieved through Dell’s trace routing and rank interleaving techniques. Dell’s omission of 2×64 GB cSO-DIMM configurations from their official specs may be a strategy to promote proprietary CAMM modules. However, laptops with Intel HX CPUs can support up to 192 GB of DDR5; using two 64 GB cSO-DIMMs is well within spec for the CPU and IMC, and many users have successfully implemented it as a cost-effective alternative to CAMM. Keep your interposer in place and consider this kit: https://www.crucial.com/memory/ddr5/ct2k64g64c52cs5

most of these setting can definitely be changes via powershell, porb why Dell retired most of the older resource hogging tools, @AL123 have a looksee here https://notebooktalk.net/topic/632-dell-precision-7670-dell-precision-7770-owners-thread/?do=findComment&comment=21688

did you look into changing power plan settings in bios to performance for low level settings, and than higher in windows power plan settings? there's also settings in NVIDIA to prefer more performance etc. in control panel setting as well as additional tweaks via external third party tools. with my 7770 i undervolted my cpu, run bios on cool profile, and windows profile in balanced mode, i created a powershell script that changed bios power plan to performance from within windows, and switched windows to maximum performance power plan (old classic power schema), the script would toggle everything back if i run it again, i think i posted it somewhere in the 7770 owners thread you could possibly adopt it to this unit easily with your preferred settings to quickly switch to pedal to the metal profile.

our sales rep called me last week to let me know they are running specials on the new 16/18 pro max's internally for limited time, it seem they proactively trying to push these out.

While SoCs do offer real engineering advantages in terms of performance per watt, the business model they enable is a major contributor to the growing e-waste problem and the erosion of consumer freedom. SoCs in personal computing are, in my view, an abomination—a step in the wrong direction for the average user. They exist not because they serve the long-term interests of consumers, but because they maximize profit, streamline manufacturing, and reinforce planned obsolescence. The trade-off is clear: ownership, control, and product longevity are sacrificed for short-term efficiency and corporate margins.

I’m not sold on the idea that this form will hold up under sustained heavy loads. Mobile chassis designs already have minimal wiggle room, and if the trade-off here is improve latency over optimizing thermals, I’d take optimizing thermals—because once temps spike, latency will happen anyway. Lower latency isn’t much of a win if the rest of the system is cooking itself. That’s not just counterproductive, it’s self-defeating in the long run.

good catch there, thats a typo i meant iGPU.

That’s generally true for desktop boards, but in laptops I’ve rarely seen it followed this closely. My guess is Dell’s doing some channel tuning for the CAMM layout—even though, in practice, CAMM performance is still mostly theoretical right now. In these mobile Precisions, CAMM is still just running dual-channel like a standard SoDIMM.

ive examined the board and components closer, it doesn't look like they are doing negative pressure, i think your sales rep sold you a nice story from the 8 second video below

ooh wow... i need a minuted to collect the few pieces i have left from my brain after it just exploded. for some reason i was sure the CPU is buried under the fans somewhere i just realized where they placed it.

im confused... there's no dGPU solution under the hood, just 1 full tilt GPU?

Thank you for the clarification @AL123 i do see the traces now for the negative fan airflow, it seem to me that under load it would be scrubbing hot air over the GPU? what ever happened to the discrete GPU with AI integration etc. where is that hiding?

@AL123 Great images, thanks for sharing. I’m honestly baffled by some of these design choices. The first glaring issue—among too many to list in one post—is thermal logic. Heat naturally rises, yet here it looks like the GPU is mounted upside-down, and possibly the CPU as well (hard to tell from the angle). That means both ‘hot plates’ are effectively facing the keyboard, while the thick vapor chamber sits below the heat source. Then there’s the wasted chassis space—large empty pockets that feel more like parts were jammed into place than thoughtfully laid out. Not a single fan appears to be positioned to push air directly over the NVMe drives or CAMM memory. Speaking of CAMM, that heat spreader has nowhere obvious to dissipate to—it seems more cosmetic than functional. From what I’m seeing here, this doesn’t look like a ground-up redesign at all. More like a rushed parts shuffle in a new shell.