Clevo X580 TBA at CES 2025 - 18", 4+4 drives and memory, 2xTB5

[1610ftw]

At supposedly 3.6kg it is a bit light weight for my taste given how weak the cooling was in its predecessor but other than that the specs are impressive:

 

18" display - finally!

 

4x M.2 slots with one of them being PCIe 5.0

 

4x DDR5 memory for a total of up to 192GB of memory which may come in handy with workstation use

 

2x TB5 - if it works this would be a great option for combining a weaker GPU for mobile use with a stronger external GPU for stationary use.

With the unified heatsink that Clevo has been using for some time now it will also help with CPU cooling. 

 

I also think it is clear that CPU and GPU will again be soldered but at least they are now making an effort to compete again in the high end workstation space that they left after the X170.

 

https://www.notebookcheck.net/Gaming-laptop-with-GeForce-RTX-5000-192-GB-RAM-4K-display-and-Thunderbolt-5-Leak-reveals-new-Clevo-flagship.937225.0.html

 

https://www.ithome.com/0/820/410.htm

 

 

[the jg89]

I've been hearing buzz about the intel ultra mobile series placed in these, you think that might be why they're deciding to make it 3.6kg since the cpus are using less power?

I just hope that this laptop is as good at it is since I'm itching to get an upgrade.

 

[win32asmguy]

7 hours ago, the jg89 said:

I've been hearing buzz about the intel ultra mobile series placed in these, you think that might be why they're deciding to make it 3.6kg since the cpus are using less power?

I just hope that this laptop is as good at it is since I'm itching to get an upgrade.

 

The key will be if they decide to use better cooling on it than the X370. I have compared the PE60SNE with the X370 and it is significantly better just by having a vapor chamber instead of heatpipes. It also needs better M.2 cooling and ideally would be compatible with RAM cooling upgrades as well. It also could use better speakers as the 2x1W solution on the X370 was barely adequate. Because the motherboard has four memory slots it will not do as well with 2x16GB, likely capping out at 6000MT/s even with the best SODIMMs.

 

You can see a photo of the backside of the X580 on Clevo's site now too:

 

https://www.clevo.com.tw/product/product_list/1

[1610ftw]

24 minutes ago, win32asmguy said:

 

The key will be if they decide to use better cooling on it than the X370. I have compared the PE60SNE with the X370 and it is significantly better just by having a vapor chamber instead of heatpipes. It also needs better M.2 cooling and ideally would be compatible with RAM cooling upgrades as well. It also could use better speakers as the 2x1W solution on the X370 was barely adequate. Because the motherboard has four memory slots it will not do as well with 2x16GB, likely capping out at 6000MT/s even with the best SODIMMs.

 

You can see a photo of the backside of the X580 on Clevo's site now too:

 

https://www.clevo.com.tw/product/product_list/1

 

I fear that is indeed the back of the X580, looks very similar except for two ethernet ports.

 

I wish they were more ambitious again with something closer to the X170 design.

[the jg89]

can someone show me the pic? I can't see it ^_^'

[1610ftw]

It is the laptop that the guy with the RGB headphones is using.

[Maro97]

[Sniffy]

Weight and Z-height look like X370 which was 3.44KG and 25mm (according to NotebookCheck). I hope they've done more than just add LEDs.

[win32asmguy]

Info is starting to trickle out about the Schenker Key 18 Pro. Still no photos of its cooling system but it is a start.

 

https://www.techpowerup.com/330672/schenker-xmg-shows-off-laptops-featuring-geforce-rtx-5090-laptop-gpu

[win32asmguy]

More info and photo in this press release:

 

https://wccftech.com/xmg-neo-16-up-to-24-gb-nvidia-geforce-rtx-5090-gpu-evo-ultrabooks-amd-strix-ryzen-ai-300-apus/

 

Still heatpipes for cooling but better breathing room around the RAM area for 1DPC configurations. Higher fin count fans.

[the jg89]

 

Looks to be heavier then the specs sheet maro97 provided, hopefully the heatsink can do a good job with cooling the laptop.

Although I don't know why they called it GDDR6 when it's supposed to be GDDR7 lol

 

 

 

[1610ftw]

It may be that the battery is "internally screwed" but the users who need direct connectivity are certainly "externally screwed".

 

X170:

3xUSB-C / DP / TB

3xUSB-A

2xMini Display Port

 

That was one of the best set of connectors ever on a laptop with an astonishing variety and number of connectors.

 

X580

2xUSB-C / DP / TB

2xUSB-A

0xMini Display Port

 

Kudos to Clevo for going from 8 to 4 connectors for these three types and instead giving us an additional ethernet port which is the last thing most people need. Worst connectivity since at least the P170 and possibly ever when it comes to Clevo workstations.

 

[1610ftw]

Better pictures here:

 

https://www.hartware.de/2025/01/07/xmg-zeigt-zur-ces-erstmals-die-2025er-modelle-des-xmg-neo-16-der-evo-serie-und-das-schenker-key-18-pro/

 

And a video that gives a better idea of the insides of the unit starting at ca. the 4 minutes mark:

 

Better cooling for the audio section and improved fans with more fins are good but the basic heatsink design looks very similar to the previous one.