Good find on that video.
My soldering thoughts:
Reballing is a PITA. I have found it easiest to use a direct heat minimally sized stencil since they warp much less. I'll also do an initially heating in a toaster oven with the stencil still in place with a very thin flux coating. The slow even heating prevents solder balls from jumping out. After that the solder balls are tacked down and I do a second heat cycle with the heat gun and much more flux to get good connections.
I also only use leaded solder balls. They are so much easier to work with than unleaded. They bond at much lower temp, are stronger, wet more easily, and pull and center parts more strongly when molten. In general it's worth removing solder from unleaded preballed parts and reballing with leaded. If I had done this I wouldn't have lost the 3080 board.
His flux seems less corrosive than mine. Mine causes pcb damage while his seemed to cause none. I should use a different flux
The GPU glue is terrible. The reason why my 3060 pcb is so discolored is because the glue was still sticking after melting the solder to remove the 3060. I had the core under high temp for quite a long time until I got it off. Once the core is off just scrape off the glue with a hot soldering iron. This is way less dangerous to the board than the way he Dremeled it.
I only use aluminum foil if plastic components are underneath. Components under foil can still get molten, and the slight pressure of the foil can shift them around.
My perf thoughts:
I also got the weird vram clock toggling. You can fix it by forcing a fixed VF target is MSI afterburner. You can see my scores are around 1K higher than his in TS, and I was just running 0.84V, which I think is sround 180W, similar to his max.
My core can benchmark at +240, and is fully stable at +210, similar to his
I'm curious in is vram clocks. Something is wrong with my setup.