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Everything posted by electrosoft
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Hmmm, never thought about doing that. I might have to add it to my project tweaks list.
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I was waiting till we have more substantive and definitive data and links. Right now, we're knee deep in the fact finding portion of the program. 😁
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*Official Benchmark Thread* - Post it here or it didn't happen :D
electrosoft replied to Mr. Fox's topic in Desktop Hardware
I'm starting to think an end cycle approach might be the best bet going forward. Wait to upgrade at the end of each cycle vs the beginning. Better pricing, availability and all the bugs and issues have been worked out and you're getting a card with the highest level of maturity and refinements and driver optimizations. I've thought about getting a 3090ti KPE and not upgrading till end cycle of 4000 in a few years to whatever is the best then too. You could also just wait till launch and by the last, best card if you want potentially used. -
*Official Benchmark Thread* - Post it here or it didn't happen :D
electrosoft replied to Mr. Fox's topic in Desktop Hardware
With those killer heatsinks installed, the dual rank 4000 sticks I bought from you run cooler at 4000 than the single rank G.skill sticks I have run at 4000 with the G.Skill covers running TM5 exteme or aida by ~3c in my system and that is with the top heatsink removed since I am running a x4 dimm slot board vs x2. -
You can definitely see the uv definitely giving some head room. When you run the same range of uv's on your other 12900k's what range of scores do you achieve? Do the other 12900k's also make it through a run without thermal throttling at -100mv? You're reaching that point where your next step is a delid with a milled, flat (and probably ever so slightly taller) copper IHS. Delids on 12th (especially 12900k) have consistently shown. The idea now is to separate (even if only by the tiniest amount) the best of your group of 12900k's and delid that one and install a proper IHS. I can't recall if you did a spread test (dollop of compound, center application, install heatsink, run a few CB23 runs to heat it up and then remove heatsink to see how it naturally spread)?
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By temps usually especially with the X15 as you are hitting thermal throttling in some instances. That last 12900k you picked up was able to pull a little more possibly because it is a better silicon sample and can pull a bit more because it isn't throttling at 125w but >125w instead. Same reason @jaybee83 might be able to pull 140w with his 12600 since it isn't as thermally limited at 125w. Nice! How is the 12900ks running in there versus the other 12900k's you've tested? I'm glad you have decently deep pockets to extend these tests to this level. Keep everything at stock and start setting some baselines and make a chart for UVs and see how they fair on a CB23 run (temp and pull wise) at -0.00, -0.50, -0.75, -0.100 (anything past this is gravy). You can also do some Cb23 10min runs to see how they handle sustained runs.
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FS: zTecPC "binned" i9-10900k delidded x170sm-g x170km-g
electrosoft replied to electrosoft's topic in Computer Components
Yep. I will give this to the ZtecPC binned 10900k. It smashed the two lesser 10900k's I tested at stock. I mean it wasn't even close. Neither could take a >0.050 UV and at the same UV level, the ZtecPC one was just flat out superior but the ZtecPC can't even touch the Silicon Lottery or LTX GS. They both left it in the dust testing on the desktop. The LTX ran a CB23 30 min loop at a 0.130 UV @ LLC3 no problem so I can't wait to see what it does in the X170SM. I'm going to recertify the SL one on the desktop since all recent testing has been on an Asus Z590-A Prime so I want consistency of results then do two fresh, clean runs on the same install at uv intervals starting at -0.090 and see which one is the winner. You know it. 😁 I'll post all final results in the SM thread. -
*Official Benchmark Thread* - Post it here or it didn't happen :D
electrosoft replied to Mr. Fox's topic in Desktop Hardware
Looking forward to your results. Is that IHS lapped or is that LM soak discoloration? -
FS: zTecPC "binned" i9-10900k delidded x170sm-g x170km-g
electrosoft replied to electrosoft's topic in Computer Components
It was a good price, but it sold tonight on €bay so it's gone. 😀 I had 5. Now down to two. I'll have one more up for sale in a few weeks after the final battle of the two titans to see which one truly reigns surpreme in the X170SM-G: LTX Golden sample (1 of 200) 10900k vs Silicon Lottery top bin 10900k -
I know a few users had tried it on the other P870 and P775/0 series models but I can't recall anyone giving it a whirl on the X170 series.
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Ztec did this to their X170's to increase pressure. They removed the stock spring loaded screws with normal screws. I ended up replacing even those with even more dialed in screws to get exacting pressure to my standards. The trick as you mention is to not overtighten them. Too much pressure and the system will not boot or it will crash as soon as you introduce any type of load that heats up the CPU and the socket/chip expands ever so slightly. I found the right pressure with a "loose hand" screw then finger tips tightening. Get a power screw driver with controllable torque and you can find the exact setting that works the best and know for future heatsink removals you have an exact setting. I might take this approach in the future. Takes a bit to dial in the exact settings through trial and error but them you know exactly what works the best and at what setting.
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*Official Benchmark Thread* - Post it here or it didn't happen :D
electrosoft replied to Mr. Fox's topic in Desktop Hardware
I am so disappointed in Intel killing off AVX512 in 12th gen. Mine still has it as do many early run chips but it makes no sense especially with AMD embracing it and applicative uses still on the rise. I am glad to see the TDP jump and more importantly see a nice, healthy PL2 of 230w which, again, will blow right out the window when we get some nice OC's going. It's a desktop There are countless cooling options available Stop focusing on power efficiency and let it soar Thin and light is really here to stay and will continue to grow. Just about every average consumer, family member and client all want thinner and lighter and base much of their purchasing decisions around that criteria fixating on what they physically want size wise in a laptop and then searching for specs within that criteria. It is a very Apple way of approaching things but at least even Apple regressed with their new line of Macbooks and they are actually heavier and thicker than the previous generation and they are receiving rave reviews versus their predecessors. I was more than happy when the market was a nice, healthy mix of proper DTRs and T&L for when you need mobility but the bean counters in their Everquest to maximize profits see the bigger, juicier profits are in cheap, throw away electronics that are still astronomically priced (I'm looking at you Alienware and Razer). -
*Official Benchmark Thread* - Post it here or it didn't happen :D
electrosoft replied to Mr. Fox's topic in Desktop Hardware
Wait.... Hold on a second! You mean to tell me the bulk of the massive profiteering the last year or so for GPU makers (especially Nvidia) was due to the crytomining market and now that it is imploding (again) their stocks drop and Nvidia can't definitively state how much of an effect the now obvious miners buying up cards had on their revenue stream? Really? -
*Official Benchmark Thread* - Post it here or it didn't happen :D
electrosoft replied to Mr. Fox's topic in Desktop Hardware
I'm gonna have to try a pair of crocs one of these days. I stick to Rebok basic betty white sneakers for even wearing around the house! Loving the continued benching and testing of older GPUs on state of the art CPUs knowing you're extracting every bit of performance out of those cards. -
Most likely the first two were in the same "average" mediocre range and you finally got a chip that is a better silicon. V variants are from China while X variants are from Vietnam. When I say 12th gen variance is extreme that is an understatement. Even at stock you're looking at end tweaking potential pull variances of ~70-75w (~162w-241w). Throw in leaky vs non-leaky chips and when you're dealing with a limited cooling solution it can make a difference. If you settle on that chip, a delid and milled, flat IHS will probably work wonders. You could also do some shim tests to see if extra height gives better temps and performance. I know on my P870TM ordering an IHS that was 4.3mm vs stock 3.3mm made a world of difference. Doing shim tests on my X170SM showed it didn't have nearly the same effect but my X170SM-G is modded from Ztec so a lot of the ground work was done already. Best way to apply nanogrease extreme is a dollop in the middle and let the natural pairing pressure spread it out where it needs to be and compensate for any gaps. Due to the rectangular shape of the IHS you may need to apply a micro sized dot above and below the central dollop. You can always do a few test applications with cheaper stuff to make sure you're getting the ideal spread.
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No problem. 🙂 Just be aware depending on ram frequency the KM can be real finicky with all 4 slots populated. Let us know if you have any problems and we'll get it sorted out one way or the other on your march to 128GB. 😄
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You don't have to take your motherboard out to upgrade the ram. Two screws to lift up the keyboard and the ram slots are right underneath.
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I would not be surprised if they are binning for 12900hx specs too as they will need a much tighter and lower V/F curve for the lower range and really don't need to hit full 12900k specs. It could go both ways. You could also bin 12900kf as they can never be binned for 12900hx or 12900ks chips as they don't have iGFX. If you have any type of potential pairing/pressure issues, nanogrease is the best as it is the thickest and helps compensate for any pairing issues while being within spitting distance of the slightly better thermal compounds. If you're confident in your pairing pressure, Kingpin is best I've found but it has a ~6mo shelf life before it starts to degrade followed by good ole gelid extreme and then EVGA Frostbite is a sleeper hit which is on par with Gelid extreme. Personally, I run Nanogrease Extreme on my laptops because I've yet to find a laptop that pairs anywhere near as exacting and tight as a desktop and it is close enough and tends to give me better temps overall. I don't use it on desktops at all. I lost confidence in Kryonaut and Conductonaut due to some bad batches so I avoid both for TIM and LM for YMMV.
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Price: $$SOLD$$ Condition: Used Warranty: None Reason for sale: Too many 10900k's Payment: PayPal (non-cc) , F2F, trade Item location: Southern NJ Shipping: USPS International shipping: To known former NBR users Handling time: 3 days Feedback: https://www.ebay.com/fdbk/feedback_profile/electrosoft Specification: In the process of binning many 10900k's and I find myself with 5 of them now floating around. This was my original ZtecPC 10900k "binned" 5.1ghz 1.35v 10900k which was originally delidded. I re-delidded it to improve thermals even more (which it did) with LM and it's original cap and properly sealed with RTV silicone. This was binned by ZtecPC specifically for optimal use in the X170 series of laptops to handle a -90 uv and keep thermals in check at stock. I was actually using this in the wife's system with an MSI Z590-A Pro but I upgraded her to 12th gen. I can also sell this with the MSI Z590-A Pro motherboard for $400 shipped if you want the combo. Proof of ownership:
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Yeah, I definitely want to see as much data as you're willing to provide. It helps fill in the caps and set baselines and expectations. Edit: Just read your comprehensive baseline data post, awesome! How are you pulling 140w when @win32asmguy was capped at 125w ? I mean, if it is a BIOS variation thing that is promising and we can focus on containing the furnace with a dialed in uv and ac/dc ll if the BIOS can be opened up enough. I know on my P870TM I dialed in everything with a fixed Vcore and ll settings to really chop off a lot of wattage and keep the CPU running within spec. So much room for improvements from binned silicon to uv to IHS to thermal compound selection to additional heatsinks and more....good stuff ahead. 🙂
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Problem is right now Intel is hoarding a lot of decent bins for 12900ks but most 12900k's will be ~SP84'ish in silicon quality which is not great. If you had an Asus board that supported SP rating (Strix D4, Prime A, Hero) you would probably see the ratings are ho hum at best. I binned 5 and really it was random luck I landed a chip that ran ridiculously low and cool. Most 12900ks chips will blow it out the water for overclocking though. Testing it on that B660M board with that small air cooler and seeing it only run ~5c hoter than a 12100f while pulling 60w more was astounding. I didn't even expect those types of results. Is it a thermal issue or a PL issue? If it is thermal issues, a delid and relid with a good IHS will work wonders. I know everybody is doing Rockitcool, but I would recommend BartX. Not only can you get a nickel plated IHS (no soak issues with LM), but he will custom make an IHS for you with additional height if needed for a tighter pairing. I've purchased a few custom made IHS's from him and they worked great. One for 9900ks and another for 10900k.
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That's a killer write up @Clamibot. I'm going to link it in the launch page.
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*Official Benchmark Thread* - Post it here or it didn't happen :D
electrosoft replied to Mr. Fox's topic in Desktop Hardware
Like Intel, AMD knows the mobile market is still the largest growth vector and BGA is everywhere and very profitable on many levels to the detriment of those who want flexibility, upgrade ability and real cooling and powerful chassis. As someone who runs multiple variants of Linux, I cringe when I see anything integrated hardware wise that even has a whiff of proprietary M$. I do like that they said AM5 will have a very long socket shelf life. One thing you can't deny is AMD extracted everything out of their previous socket and you have very old systems being able to drop in a 5800X3D and have an immediate and massive upgrade. It seems AMD has hit a wall with 16 cores but at least we're getting real cores and not this hybrid from Intel. It comes down to will the IPC and clock uplift of 7000 outduel the additional 8 E-Snores with RPL along with the cache upgrades and architectural refinements. I suspect Intel will still retain the overall IPC crown on P-Cores. No surprise it beats the 12900k by 31% on MT loads as even the 12900k barely outclassed the 5950x in MT loads. I was overall impressed with AMDs new offerings and if they hold true (remember we're seeing a presentation presenting their 7000 series in the best light), they will be worthy contenders at lower TDP albeit that has been officially raised to 170w now (vs Intel 241w) but in real world usage and overclocking? All that will fly right out the window. As for overclocking, I worked with PBO and CO for a bit before tossing it out the window and just overclocking using a traditional approach on my 5800X since PBO and CO were entirely too dependent on the type of load and had clocks all over the place including in games where you would shoot up to 5ghz and then throttle down to 4.4ghz in some situations. I preferred a fixed OC based on vcore and heat management. If Intel delivers on HEDT (fingers crossed), I don't think AMD can ignore that (or they can to their own detriment). -
Updated the launch page with a link to drivers, thanks!
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Definitely looking at some delid/relid numbers but more importantly a flatter and ever so slightly taller IHS and results. 💪
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