Etern4l Posted Sunday at 10:37 AM Share Posted Sunday at 10:37 AM On 3/6/2023 at 8:38 PM, Mr. Fox said: My impression is that something is not right with the AIO. You will certainly see improved results with a delid and liquid metal if the fit is good, so that is something worth considering regardless of the root cause. I would do that now and see where it leads and it will be out of the way and ultimately provide a benefit even if it doesn't solve the problem you are having. If fit is poor and doesn't make good enough contact for liquid metal, you should see improved temps after delid using thermal paste between the IHS and cold place. I would start with the idea that the AIO is the problem if I were in your shoes, but still do the delid first. One thing I discovered quickly is that the contact was poor on the top 25% of the IHS. I was able to correct that to near perfection by varying the tightness of top vs bottom contact frame screws (over a couple of time consuming iterations), and this resulted in significant temp improvements (10C?), however, not enough to restore performance to the initial state where I was able to pull 320-330W in CB. My current hypothesis is that because of essentially incorrect mount, the solder under the IHS sustained some sort of damage over time, truly necessitating a delid, which does actually seem like a reasonably straightforward process. I am assuming that Rockit is still the best tool to use at this time, and this seems like the only place to get it from: https://rockitcool.myshopify.com/products/copper-upgrade-kit-intel-12th-gen BTW am I correct in assuming that the Rockit copper IHS will not fit the contact frame? They advertise it as having 9% larger contact area (something Intel should have considered, in addition to using a less ****** ILM and general IHS design). If that's the case, would filing the interior of the contact frame to make it fit the larger IHS work, or would it just destroy the frame? Failing that, I would have to go back to using the ILM (if I wanted to benefit from the larger IHS), potentially risking further bending issues. On 2/18/2023 at 4:29 PM, Papusan said: @Tenoroon Did you bake in the liquid metal? What do you mean by that? Reapplying shortly after the first application (in case of any copper surfaces)? BTW @Papusan I'm assuming you delided your 13900K. Which tool and IHS (if any) did you use? 3 Link to comment Share on other sites More sharing options...
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